FD-460LXCeramic flat grinding machine

Scope of application: Widely usedLEDSingle side grinding and polishing of various materials such as sapphire substrates, optical glass chips, quartz chips, silicon wafers, germanium wafers, molds, light guide plates, fiber optic connectors, etc.

Equipment principle:

This grinding machine is a precision grinding and polishing equipment. The material to be ground and polished is placed on a grinding disc, which rotates counterclockwise. The correction wheel drives the workpiece to rotate on its own, and the workpiece is pressurized by gravity. The workpiece and the grinding disc experience relative friction to achieve the purpose of grinding and polishing.

The disc repair machine adopts hydraulic suspension guide rail for reciprocating motion, and the diamond trimming knife precisely trims the grinding disc to obtain precise flatness.

Equipment features:

1. Variable frequency control achieves soft start and soft stop, with low impact force and reduced workpiece damage.

2. The timing function is used to control the time. When processing products, the time and speed can be pre-set on the panel. When the working time jumps to the set time, the machine will automatically stop working, which can better control the product size.

3.The workpiece of the grinding machine is pressurized by the self weight of the weight block. After polishing, the surface of the workpiece has high brightness, no scratches, scratches, no material lines, no pits, no collapsed edges, and high flatness. After polishing, the surface roughness of the workpiece can reachRa0.002;

4. Adopting an interval type automatic spraying device, the spraying interval time can be freely set, and the grinding liquid can be evenly sprayed on the grinding disc to achieve the stability of the workpiece. Reducing grinding time not only saves the cost of consumables, but also meets environmental requirements.

5. Imported bearings and motors are used to ensure the stability and lifespan of the equipment, and to meet the precision requirements of the workpiece.

6.The flatness of the grinding disc can reach±0.002mm,diameter50mmThe flatness of the workpiece after processing can reach ¼ wavelength. The flatness of the workpiece after processing can reach ±0.0005mm.

Specification parameters: